Insulator: Thermoplastic
Contacts: Copper Alloy
Shell: SPCC
Underplate: 80u” Nickel
Contact Area: 30u”Pd-Ni+2u”Gold
Solder Tail Area: 100u”~200u”Matte Tin
Current Rating:
1.8Amp(Max.)shall be applied to Vbus pin and its corresponding GND pin.
0.25 Amp(Min.) shall be applied to all the other contacts.
Contact resistance:
30 mΩ (Max) initial for Vbus and GND contacts.
50 mΩ (Max) initial for all other contacts.
Insulation resistance: 100 Mohms min @ 100 DAC
Dielectric withstanding voltage: 100 VAC / minute
Temperature range: -20°C TO +85°C
Mating Cycle: 5000
