1.HOUSING:LCP WITH 30% GF,UL94V-0,BLUE
2.CONTACTS:BRASS
PLATING:CONTACTS:AU PLATED ON CONTACT AREA,
100u”MIN.BIRGHT-TIN ON SOLDER TAIL
WITH ENTIRE CONTACT UNDERPLATED 50M”MIN.NI
3.SHELL:COPPER ALLOY,50u”MIN.NI UNDERPLATING OVER ALL
1.CONTACT CUPPENT RATING
2.5A FOR PIN1&PIN4
0.25 A OTHER CONTACTS
2.CONTACT RESISTANCE:30mΩ MAX FOR PIN1&PIN4
50 MAX FOR OTHER CONTACTS
3.INSULATION RESISTANCE:100MΩ MIN
4.DIELECTRIC WITHSTANDING VOLTAGE:AC 100V(RMS)
1.MATING FORCE:35 Kg.MAX
2.UNMATING FORCE:10 Kg.MIN
1.OPERATING TEMPERATURE RANGE:-55°C TO +85°C
1.TRAY
