464DA7G27PSN003

464DA7G27PSN003

Specification
ELECTRICAL

Current Rating:0.5A.
Withstanding Voltage:AC500V r.m.s.
Insulation Resistance:1000 MΩ Minimum at DC 500V.
Contact Resistance:40 mΩ Maximum.
Mechanical Characteristics:
Mating Cycles: Total 10,000 Insertions.

ENVIRONMENTAL

Operating Temperature:-20°C to +60°C.
Storage Temperature:-40°C to +70°C.

MATERIAL

Insulation: LCP; UL 94V-0 Rated.
Contact:PHOSPHOR BRONZE C5210 R-H T=0.25mm.
SHELL:PHOSPHOR BRONZE C5191 R-H T=0.20mm.

FINISH

Contact:SELECTIVE GOLD ON CONTACT AREA, TIN PLATED (160 u” MIN.)ON SOLDER AREA,OVER NICKEL PLATED(50 u” MIN.)
SHELL:PLATING 50U”(MIN) NICKEL CAN BE SOLDERED.
SD CARD Total Mating Force:40N(MAX) at 25mm/minute
Total Unmating Force:1.0N(MIN) at 25mm/minute
MINISD CARD Total Mating Force:40N(MAX) at 25mm/minute
Total Unmating Force:1.0N(MIN) at 25mm/minute

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